Workpackages

WP1 Integration :   ( Workpackage Leader - s.team, Germany )

Integration is the main objective of this workpackage. It will


WP2 Process Technology :   ( Workpackage Leader - IMEC, Belgium )

An understanding of the principle of process technology is necessary for the whole staff in microelectronics manufacturing depending also on the depth of involvement into this topic. Therefore, this material covers the basic understanding in the general process flow, starting with the definition of CMOS and FETs, and answers the question of why process technology is constantly evolving. People should also have a good idea of both device manufacturing and issues of front-end-of-line and of interconnect manufacturing and issues in backend-of-line and get a basic understanding of what the different process modules are, how they interact with each other, and how they can affect device behaviour. The next level is a more detailed insight in individual processing steps. The processing steps are complex chemico-physical interventions on the substrate, often requiring highly complex equipment, extremely pure chemicals, and absolutely controlled conditions. Skills require good understanding of the individual processing steps, and of the fact that these steps can affect circuit behaviour and manufacturing yield.


WP3 Factory Automation and Operation :   ( Workpackage Leader - M+W Zander, Germany )

Amongst the process technology aspects, a lot of knowledge is necessary for operating a semiconductor manufacturing site. A highly automated manufacturing environment with complicated and nonlinear process flow and logistics has to be controlled by different facility monitoring and control systems. The operation of such control systems and optimisation of the production plant concerning throughput, cycle-time and efficiency requires fundamental knowledge and also continuous training of the staff. The same is valid for the automation systems in a semiconductor fab including material distribution systems, material storage systems, wafer containers and wafer handling tools.


WP4 Process and Metrology Equipment :   ( Workpackage Leader - IISB, Germany )

Process and metrology equipment is an important part in the value-added chain of a microelectronics manufacturing factory and has a great effect on the advancement of the semiconductor industry. The performance of equipment will determine the processing technology level, usually expressed in fractions of microns, that can be achieved. Equipment has to deal with different diversity, extendibility, flexibility and scalability. Factories for dynamic random access memory (DRAM) devices have to behave different to those for application-specific integrated circuits (ASIC). The use and operation of production equipment includes lots of different aspects: operation, physics, mechanics, automation, control (real-time and run-to-run), advanced process control, communication with host computers (factory interfaces), loadports, maintenance, overall equipment efficiency, cycle time, safety, installation, supply, clean-room aspects etc. Its effective and efficient operation is decisive regarding the costs of semiconductor processing and thus for costs of integrated circuits. Up to some hundreds of rather complicated and highly sophisticated non-clustered and clustered tools are used for the production of integrated circuits in up to 1000 single process steps. The material flow in this process is not straightforward and linear, but rather complicated and includes different process loops. A mis-processing in one single process step might lead to scrap of one or more production lots of considerable value. Therefore, the appropriate qualification of staff applying this equipment is extremely important. The dilemma is that many of these equipment-related aspects become rather specific in microelectronics application and a lot of mainly application-specific aspects are not covered by education. Moreover, also for technicians and operators the development of skills is essential for good yields.


WP5 Environment, Safety and Health :   ( Workpackage Leader - Tyndall National Institute, Ireland )

The reduction of energy consumption is required by the problem of global warming. Resource conservation for water, chemical compounds, materials and other raw materials are future challenges. Conserving our environment implies the substitution of toxic materials and the recycling of industrial waste. Worker protection programmes and information prior to the use of new equipment and chemical compounds have to guarantee safety and health of the industrial staff and requires continuous improvement programmes. Caused by government legislation, all these environment safety and health concerns, which affect all aspects of electronics manufacturing, have been transformed to an integral part of design and manufacturing process. To fulfill these requirements, the industrial staff has to be prepared for all that topics. Training, education, qualification and re-qualification as well as creation of environmental awareness using web-based platforms are ideal to minimize the environmental pressures and the risks to health and safety.


WP6 Management and Exploitation :   ( Workpackage Leader - IISB, Germany )

The objectives of this workpackage are to ensure the management of the project (and in particular technical and financial reporting) and ensure the consistency of the work between partners and work-packages.